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* Recruiting areas focusing on R&D (by business and technology)
* We separately announce the recruitment of staff in other areas, as deemed necessary.
By Business By Technology
Opto Device
Satellite DMB Development
EPI Characteristic Analysis/ Growth
Chip process development
LED Packaging
Small size LCD
Driver circuit Design
Set Interface design
Optical Lens Design
Cell Design/Application
Reliability Design/test & Analys
Camera
Module
Optical Lens Design
Oprical Mechanism Design
Image Optimization design
TU
Analog Signal Process Technology
RF / IF Signal Process Technology
CAD & Mechanical Design Technology
Digital Signal Process Technology
RF Mo/Demo ( Tranceiver ) Design
S/W ( M-COM Application )
Up/Down Converting
ASIC Design
MOTOR
Motor Magnetic Curcuit Design
Motor Structure Design
Motor Electronic Curcuit Design
Thermal Fluid Design
Vibration/Noise Measurement/Estimation
Satellite DMB Development
RF/Digital Curcuit Design ,Simulation Design
Circuit Design & Lay out Design
High dense packaging design
MMIC Circuit Design
Set Application Design
By Business By Technology
POWER
PFC Circuit Design Technology
Thermal Analysis Technology
Protection Design Technology
Electrical Performance Test Technology
SMPS Design Technology
CVT topology Design & Analysis Technology
Software, Mechanical/Circuit CAD Design Technology
R&D Planning
Wireless
Module
RF signal processing
Bare Die PKG Design
Software Design
common field
DSP/ASIC Design Technology
RF Integrated Module
RF Circuit Design Technology
RF Structure Analysis
Package Process Technology
Power
(IPM development)
Power Device & Drive I.C. Design
PKG & Process Design
System Application Design
motor drive design
MCM
Process
ASIC Application/Design
Raw Material
RF Module Design
Package field
3D Design
LTCC Design / Architecture
Packaging
Production engineering
Bare Die Mount / Package Tech
Signal Process / Measure,Control (S/W)
LCM Process Technology
POL Attach/COG/FOG Process
Lcd Module Ass'y (LCM) Process