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R&D

Secure the core technology leadership for the advanced Materials & Components. LG Innotek is leading to secure the source of technology and the next generation technology in the component material among 9 core technology areas through the

LG Innotek built up the Global R&D Network through the strategic alliance with the excellent companies and R&D institutes in US, Europe, and Japan and so on, with which we are continuously challenging to the futuristic advanced technology area, having secured the Technology Leadership.
 
LG Innotek also strives to secure the innovative technology through jointly carrying out the government sponsored projects with the government-donated research institutes such as the Korea Photonics Technology Institute and Korea Institute of Energy Research. In addition, LG Innotek is contributing to the development of nation and regional community by continuously conducting the various R&D projects and running the customized Master courses for companies with the several universities as the co-operation programs. LG Innotek offers the best customer value. LG Innotek is developing the digital information and home appliances, the wireless telecommunication, and the core components for display area, making the finished set products have small size, advanced function and high-technology on the basis of 5 core technology in materials area and 7 core technology in component area.
 
LG Innotek will strive to leap up as the global specialized electronic component company by securing the source of technology and leading the next generation technology with the duty in the material and component industry that is the foundation of electronic industry’s development.

5 core technology in materials sector

  • Photolithography - The technology to make the pattern by selectively exposing the board embrocated by photosensitive liquid via Photo Mask
  • Etching - The technology to remove thin film, on which part sensitizer was removed, selectively by physical or chemical method.
  • Thin Film Deposition - The technology used for forming the nano structure or high-quality thin film, which make the materials deposited on the board by vaporization or plasma in vacuum condition.
  • Plating - The technology to improve the surface condition or to form the minute pattern by plating the thin metal membrane on the metal or non-metal surface.
  • Simulation - The technology to estimate the characteristics and the functions of products before pioneer production by using computer like CAE (Computer Aided Engineering).

7 Core Technology in Components Sector

  • RF Circuit Design - The technology to optimize the function of receiving part that transformed the received data into the original data after analyzing the wanted frequency signal compared to the transmitting part that send the data at high frequency.
  • Precision Driving Mechanism - The technology to maximize the efficiency by optimizing the combination among components through the techniques of the interpretation of electromagnetic field, precision structure design, and electronic & electric circuit design for the products that requires the precision driving.
  • Precise Mounting / PKG - The technology to integrate one or more active components and to make the passive component such as L/C/R with other required component as one package.
  • Optical Design - The technology to improve the function by controlling the geometrical optical and optical diffraction characteristics of light for the products such as BLU, lighting, and camera modules.
  • Optical Components - The technology to design the high efficient electric light component by optimizing the deposition control of LED, electrode pattern and materials on the basis of semiconductor process technology such as Epitaxy, Deposition, Photolithography, and Etching.
  • Power Circuit Design - The optimizing technology for the low power consumption, low noise, and high efficient function by PFC circuit design, Thermal Analysis, Protection design, and SMPS design technology for the development of Inverter, PSU, and IPB.
  • Software - Mainly the embedded software, which can implement the specific functions required by the products or components mounted in the products.
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