Product description
This is a component that connects the display panel mounted on smart phone, TV, etc. to the driving chip and main circuit board.
As a high-performance product with a microcircuit design on both sides of the film, it is suitable for high resolution displays and mobile devices.
It can be folded or rounded, so you can diversify designs such as smartphones and smart watches with flexible display.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- Compact
- High Precision
- High Resilience
- Fine Pitch Patterning
Reduction of the inner lead pitch of the integrated chip drive (reducied chip size)
Implementation of multichannels
- Compact and Highly Flexibile
Increasing the degree of freedom of module’s component connection and minimizing the assembly areas
- High Resolution Optical Test
Automatic precision test on the microcircuit
Product Specifications
Category | Specification |
---|---|
Polyimide(PI) Thickness | 35μm |
Copper(Cu) Thickness | 8μm |
Fine Pitch | 18μm |
Line / Space | 8μm / 10μm |
Plating | Tin(Sn) |
Solder Resist | Halogen free |
Related News
Date | Title |
---|---|
2018/04/23 | LG Innotek Participated in the KPCA Show 2018 |