Product description

This is a component that connects the display panel mounted on smart phone, TV, etc. to the driving chip and main circuit board.

As a high-performance product with a microcircuit design on both sides of the film, it is suitable for high resolution displays and mobile devices.

It can be folded or rounded, so you can diversify designs such as smartphones and smart watches with flexible display.

Product Inquiry

For product inquiries, please contact the person in charge.

Features

초소형
Small
고정밀
High precision
고탄력
High resilience
    Fine Pitch Patterning

    Reduction in inner lead pitch of the Drive IC (reduced chip size)

    Implementation of multi channels

    High flexibility Small

    Expanded degree of freedom of connection of module s and miniaturization of assembly area

    Optical test with high resolution

    Automatic precision test on microcircuit

Product specification

Category Specification
PI Thickness 35 um / 38 um
Cu Thickness 8 um
Fine Pitch 20 um
Line / Space 8 um / 12 um
Plating Sn
Solder Resist Halogen free

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