Product description

This is a component that connects the display panel mounted on smart phone, TV, etc. to the driving chip and main circuit board.

As a high-performance product with a microcircuit design on both sides of the film, it is suitable for high resolution displays and mobile devices.

It can be folded or rounded, so you can diversify designs such as smartphones and smart watches with flexible display.

Product Inquiry

For product inquiries, please contact the person in charge.

Features

초소형
Small
고정밀
High precision
고탄력
High resilience
    Fine Pitch Patterning

    Reduction in inner lead pitch of the Drive IC (reducing the chip size)

    Implementation of multi channels

    High flexibility, light, thin, short and small

    Increasing the degree of freedom of module’s component connection and minimizing the assembly area

    High resolution optical inspection

    Automatic precise testing of the micro circuit

Product specification

Category Specification
PI Thickness 35μm
Cu Thickness 8μm
Fine Pitch 18μm
Line / Space 8μm / 10μm
Plating Sn
Solder Resist Halogen free

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