Product description
This is a component that connects the display panel mounted on smart phone, TV, etc. to the driving chip and main circuit board.
As a high-performance product with a microcircuit design on both sides of the film, it is suitable for high resolution displays and mobile devices.
It can be folded or rounded, so you can diversify designs such as smartphones and smart watches with flexible display.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- Small
- High precision
- High resilience
- Fine Pitch Patterning
Reduction in inner lead pitch of the Drive IC (reducing the chip size)
Implementation of multi channels
- High flexibility, light, thin, short and small
Increasing the degree of freedom of module’s component connection and minimizing the assembly area
- High resolution optical inspection
Automatic precise testing of the micro circuit
Product specification
| Category | Specification |
|---|---|
| PI Thickness | 35μm |
| Cu Thickness | 8μm |
| Fine Pitch | 18μm |
| Line / Space | 8μm / 10μm |
| Plating | Sn |
| Solder Resist | Halogen free |
Related News
| Date | Title |
|---|---|
| 2018/04/23 | LG Innotek Participated in the KPCA Show 2018 |