Product description

This is a PCB manufactured by layering conductor layer / insulation layer one by one.

Interlayer electrical circuit is supplied by using a laser drill, and its wiring density is higher than the conventional PCB since it uses circuit wiring of fine pattern.

Product Inquiry

For product inquiries, please contact the person in charge.

Features

고다층
High multi layers
고밀도
High density
초슬림
Ultra slim design
    Implementation of fine line width

    Line & Space - 40um / 40um

    Ultra-slim structure

    Thickness: 0.60mm (at 12Layer)

    High yield rate

    Anylayer(The highest level in the world)

Product type

Category Specification
EPD, EPAD Passive Device : 0402 Scale available
Active Device : WLP, Bare Die Available
Cavity PCB Cavity Size : Max 40 * 40mm
(With Pad, Without Pad)
Anylayer Thickness : 0.6mm (at 12Layer)
Fine Pattern : Line & Space 40/40um

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