Product description

This product is a substrate that attaches IC chip that stores important information required for passport, ID card, credit card, etc. on the board and transmits information as electric signal.

It has two types: contact and contactless. The contact type is divided into single type and dual type that can enable NFC function.

Product Inquiry

For product inquiries, please contact the person in charge.


High density
Ultra slim
    Various surface treatment technologies

    Ni/Au, Ni/Pd, LG SIM, Ultra Sim plating, etc.

    AFVI(Auto Final Visual Inspection)

    Improved the reliability of error detection through automatic optical inspection

Product type

Category Specification (Single) Specification (Dual)
Copper Foil N/A 29um / 35um
Adhesive N/A 25um
Core Epoxy Type PPG Epoxy Type PPG
Core Thickness 100 um / 120um 100 um / 120um
Adhesive 25um 25um
Copper Foil 29um / 35um 29um / 35um
Plating Ni / Au, Ni / Pd Ni / Au, Ni / Pd

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