Product description

This product is a substrate that attaches an integrated circuit (IC) chip, which stores important information required for passports, ID cards, credit cards, etc., on a circuit board and transmits information as an electric signal.

It has two types: contact and contactless. The contact type is divided into a single type and dual type that can enable near-field communication (NFC).

Product Inquiry

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High Density
    Various Surface Treatment Technologies

    Compatible for Ni/Au, Ni/Pd, LG sim, ultrasim plating, etc.

    Auto Final Visual Inspection (AFVI)

    Improved reliability of error detection through automatic optical inspection

Product Type

Category Specification (Single) Specification (Dual)
Copper Foil N/A 29 / 35 µm
Adhesive N/A 25 µm
Core Epoxytype PPG Epoxytype PPG
Core Thickness 100 / 120 µm 100 / 120 µm
Adhesive 25 µm 25 µm
Copper Foil 29 / 35 µm 29 / 35 µm
Plating Ni/Au, Ni/Pd Ni/Au, Ni/Pd

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