Product description
This is a substrate manufactured by mounting semiconductor chips directly on a thin film printed circuit board (PCB). It serves to transmit electrical signals to the display panel.
It is the right material for the next generation Flexible/Wearable Display and enables the thin and narrow bezel of the smartphone.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- High density
- Ultra slim
- flexibility
- Fine Pitch Patterning
Reduction in inner lead pitch of the Drive IC (reduced chip size) and establishment of multi-channels
- High flexibility Small
Expanded degree of freedom in connection of modules and miniaturization of assembly area
- Optical inspection with high resolution
Automatic precision test on microcircuit
Product specification
| Category | Specification |
|---|---|
| PI Thickness | 35 um / 38 um |
| Cu Thickness | 8 um |
| Fine Pitch | 20 um |
| Line / Space | 8 um / 12 um |
| Plating | Sn |
| Solder Resist | Halogen free |
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