Product description
Chip-on-flm or COF is a substrate manufactured by mounting semiconductor chips directly on a thin film printed circuit board (PCB). It serves to transmit electrical signals to a display panel.
It is the ideal material for the next generation of flexible and wearable displays, such as that of smartphones with a thin and narrow bezel.
Product Inquiry
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Features
- High Density
- Ultraslim
- Flexibility
- Fine Pitch Patterning
Reduction of the inner lead pitch of the integrated chip drive (reduced chip size) Implementation of multi-channels
- Compact and Highly Flexible
Greater freedom for module connections and the reduction of assembly areas
- High-Resolution Optical Test
Automatic precision test on the microcircuit
Product specification
| Category | Specification |
|---|---|
| Polyimide (PI) Thickness | 35 / 38 µm |
| Copper (Cu) Thickness | 8 µm |
| Fine Pitch | 20 µm |
| Line / Space | 8 / 12 µm |
| Plating | Tin (Sn) |
| Solder Resist | Halogen free |
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