Product description

This is a substrate manufactured by mounting semiconductor chips directly on a thin film printed circuit board (PCB). It serves to transmit electrical signals to the display panel.

It is the right material for the next generation Flexible/Wearable Display and enables the thin and narrow bezel of the smartphone.

Product Inquiry

For product inquiries, please contact the person in charge.

Features

고밀도
High density
초슬림
Ultra slim
유연성
flexibility
    Fine Pitch Patterning

    Reduction in inner lead pitch of the Drive IC (reduced chip size) and establishment of multi-channels

    High flexibility Small

    Expanded degree of freedom in connection of modules and miniaturization of assembly area

    Optical inspection with high resolution

    Automatic precision test on microcircuit

Product specification

Category Specification
PI Thickness 35 um / 38 um
Cu Thickness 8 um
Fine Pitch 20 um
Line / Space 8 um / 12 um
Plating Sn
Solder Resist Halogen free

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