Product description

This product minimizes the mounting area of semiconductor parts.

It is an innovative substrate made of very thin material with 3-layer structure.

Product Inquiry

For product inquiries, please contact the person in charge.


High density
Ultra slim
    Thickness tolerance control by Layer (PSR / Cu / Resin): Implementation of ultra-slim product
    Optimization of manufacturing process and computerization of process monitoring lead to high reliability
    Warpage control
    Thickness Tolerance control

Product specification

Category Specification
Layer 3 Layers
Total Thickness 90 ± 10um
Material Ultra low CTE / High Tg
Line and Space 25 / 25 um

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