Product description
This product forms a lead bump that becomes an electrode on the surface of a semiconductor chip. It is manufactured by connecting the chip and the conductor terminal of the substrate via the bump without using a metal wire.
It is a premium value-added product that shortens the connection length among electrode terminals and greatly reduces the loss of high-frequency signals.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- High Density
- Ultraslim
- Implementation of ultra compact and ultra-slim packaging
- Improved signal transmission speed
- Noise reduction for high-frequency bands
Product type
| Category | Specification |
|---|---|
| Layer | 3/4 Layers |
| Fine Line / Space | ETS (Embedded Trace) 12 / 12 µm |
| Material | Ultra low CTE / High Tg |
| Bonding Method | TCFC |
1) TCFC: Thermal Compression Flip Chip Bonding