Product description

This product forms a lead bump which becomes an electrode on the surface of the semiconductor chip. It is a product manufactured by connecting the chip and the conductor terminal of the substrate via the bump without using a metal wire.

It is a high value-added product that shortens the connection length among electrode terminals and greatly reduces loss of high frequency signal.

Product Inquiry

For product inquiries, please contact the person in charge.


High density
Ultra slim
    Implementation of ultra compact and ultra slim package
    Improved signal transmission speed
    Noise reduction in high frequency band

Product type

Category Specification
Layer 3/4 Layers
Fine line / space ETS (Embedded Trace) 12 / 12um
Material Ultra Low CTE / High Tg
Bonding Method TCFC1)

1) TCFC :Thermal Compression Flip chip Bonding