Product description

It is a PCB with hybrid structure which is made by integrating Flexible PCB that uses Polyimide (PI) with Rigid PCB.

The new PCB is mainly used on multi-functional electronic products as the flexibility of its raw materials enable 3D circuit connection while enhancing the rigid part density of surface mounting.

Product Inquiry

For product inquiries, please contact the person in charge.

Features

유연성
Flexibility
고밀도
High-density
초슬림
Ultra-thin
미세성
Three-dimensional circuit connection
    Implementation of fine line width

    Line & Space : 50um / 60um

    CSP Pitch : 0.4mm

    High yield rate: LX_Bump (The highest level in the world)

Product type


Category Specification
LX_Bump Thickness : 0.83mm (at 12Layer)
CSP Pitch : 0.4mm
Anylayer Thickness : 0.63mm (at 10Layer)
Impedance control : 90Ω±10%