Product description
This product combines the integrated circuit , radio frequency , logic chip, and othr elements in a single semiconductor package, and implements complex functions under one system.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- High Density
- Ultraslim
- High Reliability
- Provides a high degree of freedom of design for the implementation of ultra small packaging
- Capable of supporting a thin substrate by eliminating the need for a core layer
- Maximized unctions by enhancing the amount of thermal vias
- Overcomes incoming line limitations through the configuration of tailless technology
- Overcomes the limitations of fine a pattern
Product Type
| Category | Specifications |
|---|---|
| Layer | 2/3/4/5/6/7/8/9/10 Layers |
| Material | Low CTE / Low Dk&Df |
| Fine Line / Space | 12 / 10 µm |
Related News
| Date | Title |
|---|---|
| 2018/04/23 | LG Innotek Participated in the KPCA Show 2018 |