Product description

This product combines the integrated circuit , radio frequency , logic chip, and othr elements in a single semiconductor package, and implements complex functions under one system.

Product Inquiry

For product inquiries, please contact the person in charge.

Features

고밀도
High Density
초슬림
Ultraslim
신뢰성
High Reliability
    Provides a high degree of freedom of design for the implementation of ultra small packaging
    Capable of supporting a thin substrate by eliminating the need for a core layer
    Maximized unctions by enhancing the amount of thermal vias
    Overcomes incoming line limitations through the configuration of tailless technology
    Overcomes the limitations of fine a pattern

Product Type

Category Specifications
Layer 2/3/4/5/6/7/8/9/10 Layers
Material Low CTE / Low Dk&Df
Fine Line / Space 12 / 10 µm

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