Product description

This product combines the integrated circuit , radio frequency , logic chip, and othr elements in a single semiconductor package, and implements complex functions under one system.

Product Inquiry

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High Density
High Reliability
    Provides a high degree of freedom of design for the implementation of ultra small packaging
    Capable of supporting a thin substrate by eliminating the need for a core layer
    Maximized unctions by enhancing the amount of thermal vias
    Overcomes incoming line limitations through the configuration of tailless technology
    Overcomes the limitations of fine a pattern

Product Type

Category Specifications
Layer 2/3/4/5/6/7/8/9/10 Layers
Material Low CTE / Low Dk&Df
Fine Line / Space 12 / 10 µm

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