HOME Products PCB Build-up PCB

PCB

Build-up PCB

Build-up PCB is high-density multilayer PCB processing and producing holes by laminating gradually with laser technology.

Manufacturing process of Build-up PCB is similar to that of existing multilayer PCB, but this product overcomes the process limit of mechanical drill and can produce minute holes which are smaller than 100 micron utilizing laser drill. As it is simple to form fine circuit wiring and wiring density is higher than existing PCB, Build-up PCB is applied to the main boards of mobile phones, smart phones and PDAs and to key pad products. With LX-BUMP (LG Excellent Build-up Multi-layer Process) technology, LG Innotek’s Build-up PCB advances electronic products’ ultra-slimness and multi-function. Having established the exclusive production line of Build-up PCS for mobile phones, LG Innotek develops and produces custom-made products.

Features

Multi layer High density Ultra slim

Applied Products

: Mobile Phone, Smartphone, PDA, notebook

Ask LG Innotek Stock Careers Webzine TOP