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Package Substrate

As a secondary substrate connecting semiconductors with the main substrate, Package Substrate is a core part that helps semiconductor chips perform well.

Responding to the high integration of semiconductors, which is based on the current of miniaturization and high efficiency of electronic and communications equipment, Package Substrate is a high-tech component that has overcome the limit of semiconductor assembly technology relied solely on existing Lead Frame. LG Innotek is very proud of Package Substrate’s world-class quality obtained via In-Line Process adoption and In-House manufacturing process, and this product is applied to all kinds of semiconductors such as CPU, graphic chips, D-Rams, RF modules and memory cards. Through the development of key technology such as Fine Pitch, Small Via, Thin Layer Processing and Hign Reliability, the performance of high-tech semiconductors is maximized.

Features

High density Ultra slim

Kinds of Product

Flip Chip - Flip Chip: This is a terminal connecting substrates with chips electrically. It allows small size package to be manufactured as it can save space. Having been equipped with manufacturing capacity using MSAP and SAP technology, LG Innotek’s Flip Chip can replace Fine pattern.

PBGA(Plastic Ball Grid Array) - PBGA(Plastic Ball Grid Array): PBGA is the best suited package to microprocessor, Gate array, memory, DSP and chipset. So, it is widely used in mobile phone, PCMCIA card and laptop which are highly efficient and portable.

TABGA(Tape Array Ball Grid Array) - TABGA(Tape Array Ball Grid Array): As a kind of CSP (Chip Scale Package), it is the same with chip in size and plays a role of medium to connect substrates with minimized, lighter chips. TABGA is an advanced form of existing Lead Frame and made of tape and copper. This also reduces the mounted surface of parts and, with no external terminal, is strong against noise.

Applied Products

CPU, DRAM, memory card

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