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Tape Substrate

Tape substrate is the thin tape-type substrate to mount the semiconductor chips.

The Drive ICs of LCD or PDP panel are mounted on the LG Innotek’s tape substrate, which also connects the panel to the main board, including products such as COF (chip on Film) and TCP (Tape Carrier Package). The Drive ICs are being developed, which can achieve the more precise driving signal and high resolution to meet the trend of multi-function and high-performance. LG Innotek’s Tape Substrate maximizes performance of Drive IC for faster and sharper image. LG Innotek’s top class of Photo Etching technology in the world enables the production of high-density & high-precision substrates, allowing LG Innotek’s to contribute for the design freedom of display products and reliability and improving efficiency of product assembly and productivity.

Features

High density Ultra slim

Kinds of Product

COF (Chip On Film) - COF is the recently developed packaging technology to satisfy the high-density Driver IC’s trend of slimness, lightness, and microminiaturization for the display and telecommunication devices. The much finer pitch between leads than the current 50~38㎛ and thin film can be used. COF enables the high-performance and high-integration of Driver ICs to meet the trend of increase of LCD’s pixel numbers, in order to achieve high resolution image of the display device, semiconductor, and mobile phone’s PCB.

TCP (Tape Carrier Package) - TCP is one of the wireless bonding technologies among the assembly and mounting technologies of high -integrated semiconductor chips, which uses the patterned tape instead of lead frame. TCP indicates the package to use TAB (Tape Automated Bonding) technology that connects IC Chip to Tape Film and seal it with resin.

Applied Products

COF, TCP

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