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CSP : This product reduces the mounting area of a semiconductor component to the size of a chip.

product descriptions

LG Innotek controls the thickness tolerance per layer (PSR/Cu/Resin) to produce an ultra-thin product, satisfying the needs of customers. The company optimized the manufacturing process and computerized the process monitoring to provide customers with highly reliable products. The company succeeded in mass-producing 3-layer 90 μm products and preparing itself for the 3-layer 80 μm product market, leading the trend for reduced thickness in the packaging market.


  • High Density
  • Ultra Slim
  • ① Implements ultra-thin products
  • ② Secures high reliability
  • ③ Controls warpage
  • ④ Controls thickness tolerance

kinds of product