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PRODUCTS

Flip Chip CSP

Flip Chip CSP : A product that packages silicon die directly on substrates using solder bump and Copper bump pad instead of wire bonding.

product descriptions

FCCSP offers innovative enhancement in electrical performance over existing wire bonding type and features a greater routing density in narrow areas by eliminating wire bonding loop. In particular, FCCSP that embeds MLCC enables stable transmission of electrical signals and small form packaging.

features

  • High Density
  • Ultra Slim
  • ① Super compact design
  • ② Improved signal transmission speed
  • ③ Noise reduced in high frequency bands
  • Because of the above merit, now package trend is being accelerated from Wire Bonding CSP to Flip Chip CSP

kinds of product