Product description
This product is a substrate that attaches IC chip that stores important information required for passport, ID card, credit card, etc. on the board and transmits information as electric signal.
It has two types: contact and contactless. The contact type is divided into single type and dual type that can enable NFC function.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- High density
- Ultra slim
- Various surface treatment technologies
Ni/Au, Ni/Pd, LG SIM, Ultra Sim plating, etc.
- AFVI(Auto Final Visual Inspection)
Improved the reliability of error detection through automatic optical inspection
Product type
| Category | Specification (Single) | Specification (Dual) |
|---|---|---|
| Copper Foil | N/A | 29um / 35um |
| Adhesive | N/A | 25um |
| Core | Epoxy Type PPG | Epoxy Type PPG |
| Core Thickness | 100 um / 120um | 100 um / 120um |
| Adhesive | 25um | 25um |
| Copper Foil | 29um / 35um | 29um / 35um |
| Plating | Ni / Au, Ni / Pd | Ni / Au, Ni / Pd |
Related News
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