Product description
This product forms a lead bump which becomes an electrode on the surface of the semiconductor chip. It is a product manufactured by connecting the chip and the conductor terminal of the substrate via the bump without using a metal wire.
It is a high value-added product that shortens the connection length among electrode terminals and greatly reduces loss of high frequency signal.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- High density
- Ultra slim
- Implementation of ultra compact and ultra slim package
- Improved signal transmission speed
- Noise reduction in high frequency band
Product type
| Category | Specification |
|---|---|
| Layer | 3/4 Layers |
| Fine line / space | ETS (Embedded Trace) 12 / 12um |
| Material | Ultra Low CTE / High Tg |
| Bonding Method | TCFC1) |
1) TCFC :Thermal Compression Flip chip Bonding