Product description

This product combines integrated circuit (IC), RF, Logic Chip, and elements in a single semiconductor package, and implements complex functions in one system.

Product Inquiry

For product inquiries, please contact the person in charge.


High density
Ultra slim
High reliability
    High degree of freedom of design: Ultra small package can be implemented
    Can support thin substrate by eliminating the need for core layer
    Functions maximized by enhancing the amount of thermal vias
    Tailless technology to overcome incoming line limitation
    Can overcome the limitation of fine pattern

Product type

Category Specification
Layer 2/3/4/5/6/7/8/9/10 Layer
Material Low CTE / Low Dk&Df
Fine line / space 12 / 10 um

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