Product description
This product combines integrated circuit (IC), RF, Logic Chip, and elements in a single semiconductor package, and implements complex functions in one system.
Product Inquiry
For product inquiries, please contact the person in charge.
Features
- High density
- Ultra slim
- High reliability
- High degree of freedom of design: Ultra small package can be implemented
- Can support thin substrate by eliminating the need for core layer
- Functions maximized by enhancing the amount of thermal vias
- Tailless technology to overcome incoming line limitation
- Can overcome the limitation of fine pattern
Product type
| Category | Specification |
|---|---|
| Layer | 2/3/4/5/6/7/8/9/10 Layer |
| Material | Low CTE / Low Dk&Df |
| Fine line / space | 12 / 10 um |
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