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Pushing Boundaries with Next-Generation Substrate Innovations
Pushing Boundaries with Next-Generation Substrate InnovationsIntroAs the global electronics industry evolves at an ever-increasing pace, package substrates are no longer mere components—they have become the starting point for innovation. Reflecting this shift, the KCPA Show (International PCB and Semiconductor Packaging Industry Exhibition) offers a front-row view of the latest industry trends, where LG Innotek each year showcases its cutting-edge technologies and strategic developments.At this year’s exhibition, LG Innotek unveiled groundbreaking innovations, including the world’s first successfully developed and mass-produced copper post (Cu Post) technology, high-value semiconductor substrates such as Flip Chip Ball Grid Array (FC-BGA), and industry-leading products in the Package Substrate and Tape Substrate segments that are shaping the global market.To illustrate the vision behind these advancements, we spoke with Woonsu Oh and Seungkyun Hong of the Substrate & Material Product Planning Team. At the forefront of designing the future of next-generation substrate technologies, they shared with us LG Innotek’s vision for the future of high-performance substrates and its roadmap for innovation.Q. Could you briefly explain the primary objectives and expectations of LG Innotek’s participation in this exhibition?For the past 55 years, LG Innotek has led the global substrate market through continuous challenges and technological innovation. By leveraging our expertise in material processing, precision manufacturing, and production technologies, we have consistently delivered differentiated value to our customers. In this exhibition, we are showcasing our market-leading products—the culmination of our technological innovations—as well as next-generation substrate technologies that set us apart. We also see it as an opportunity to connect with new customers and partners and share our vision for the future.Q. The Cu Post technology, which LG Innotek successfully developed and mass-produced for the first time in the world this June, has drawn considerable attention at this exhibition. What distinguishes this technology from conventional approaches?The essence of Cu Post technology is in using copper pillars to connect the semiconductor substrate with the mainboard. Unlike conventional methods that place solder balls directly onto the substrate, this approach first builds ‘copper posts’ and then mounts smaller solder balls on top. By doing so, it reduces bump pitch—that is, the spacing between solder balls—allowing more signal circuits to be integrated. As a result, overall thickness and size can be reduced by up to 20%. Since semiconductor substrates are constructed in multilayer form, their efficiency depends heavily on how well signals are managed in the lower layers. In this respect, Cu Post technology plays a central role in enhancing both performance and circuit density.Furthermore, copper (Cu) has about seven times higher thermal conductivity than solder (Pb), which means the post structure remains stable even during high-temperature processes. This stability enables a denser arrangement of solder balls, making the technology particularly effective for advanced, miniaturized applications such as RF-SiP (Radio Frequency–System in Package) substrates used in smartphones.Q. From a consumer standpoint, which products or experiences most clearly demonstrate the benefits of this technology?The most direct application of this technology is in smartphones, which are closely tied to daily life. As major manufacturers compete to create slimmer devices, component miniaturization has become a central industry focus. By enabling higher performance and greater integration, this technology increases design flexibility, allows for thinner form factors, and improves heat dissipation—reducing risks of chip performance degradation or signal loss—ultimately ensuring stable mobile performance.Q. Establishing copper post is widely regarded as a highly challenging process in the industry. What enabled LG Innotek to successfully apply this technology in mass production?The key was departing from conventional manufacturing methods and adopting a completely new approach—a process that naturally involved significant challenges. We began by thoroughly analyzing customer pain points related to high-density, high-performance semiconductors and heat management. Based on this, we developed advanced enabling technologies aligned with customer product roadmaps, providing differentiated solutions and world-class technological competitiveness.Additionally, achieving adequate height and thickness while maintaining uniformity in copper posts requires repeated batch plating. LG Innotek established dedicated production lines to ensure stable and efficient manufacturing. During mass production, we actively used 3D digital twin simulation to accelerate development and enhance the completeness of the developed product , while consistently controlling yield and variability.Q. A large body FC-BGA sample was unveiled for the first time. Could you describe current industry trends for FC-BGA and LG Innotek’s progress in its development?Indeed. At this exhibition, LG Innotek introduced for the first time a large body FC-BGA sample for AI and data center applications, measuring 118 mm × 115 mm. FC-BGA substrates are used to connect CPUs and GPUs in laptops, desktops, and data centers, as well as network switch chips and semiconductors for autonomous vehicles, to their respective mainboardsWith the increasing demand for high-performance semiconductors in the 5G, AI, and automotive electronics markets, LG Innotek has positioned FC-BGA as a key future technology. To meet the growing need for high-density, high-speed semiconductor packaging, we have developed multi-layer, large body FC-BGA substrates. Our differentiated substrate technologies include Warpage Key Parameter optimization solutions using simulation, as well as a range of core-processing techniques designed to stabilize signal and power delivery. Minimizing warpage in the core layers—the structural backbone of the substrate—is particularly important, as it prevents bonding defects and signal or power imbalances, ensuring both stable performance and manufacturability.Q. Beyond this, LG Innotek has showcased a variety of substrate initiatives. Which next-generation substrate innovations do you consider most noteworthy?We would like to draw attention to the glass substrate and glass interposer technologies currently under advanced development at our CTO, as well as chip embedding technology being developed by the Substrate & Material Business Unit. Glass substrate technology is emerging as a next-generation solution to warpage issues in high-end, large-area packages by replacing conventional core materials with heat-resistant, high-speed glass.Because glass is a challenging material to process, precise handling is essential. We utilize TGV (Through Glass Via) shaping technology to drill fine holes, achieving high aspect ratios. Additionally, since glass is non-conductive, reliable plating is critical. To address this, we employ plating adhesion control, thickness planarization, and fine-pattern technologies to minimize signal loss and enhance package reliability. Prototype production is underway, with mass production targeted for 2027–2028.Chip embedding technology reduces power noise by shortening signal paths, improving power delivery, and enabling small form factor implementations across diverse components, materials, and substrate thicknesses.Q. Looking ahead, what unique customer value is expected from LG Innotek’s innovative substrate technologies?Our technology is not simply about supplying components—it stems from a deep commitment to supporting our customers’ success. From the PoC stage, we analyze cutting-edge industry trends and anticipate customer pain points to provide tailored solutions. By leveraging digital 3D simulation technology to replace traditional sample production and evaluation processes, we have been able to shorten development cycles and respond promptly to customer delivery schedules. This combination of strategic foresight and technical excellence has enabled us to maintain our position as a global market leader and earn strong customer trust.Moving forward, we will continue to drive innovation in the substrate industry while realizing our vision in close collaboration with customers. We invite you to stay with LG Innotek as we pursue new challenges and growth, powered by relentless technological innovation.
