![인사이트 이미지]()
Tech Article
FC-BGA: A Game Changer Reshaping the Future Semiconductor Market
IntroAs advances in technology continue to drive demand for faster, higher-volume signal processing, the key factor determining semiconductor performance is expanding beyond chip design to include packaging architecture. In particular, as the internal package structure that connects chips and systems becomes an increasingly critical determinant of performance, the role of package substrate responsible for signal transmission is also growing in importance.As the importance of package substrates continues to grow, high-performance package substrate technologies capable of supporting both high-density signal processing and advanced miniaturization are drawing increasing attention, with Flip-Chip Ball Grid Array (FC-BGA) technology at the center of this trend. As discussed in the previous FC-BGA trend overview, the rapid expansion of AI, data centers, and high-performance computing markets is establishing FC-BGA as an indispensable solution across a wide range of industries, driven by its superior signal density and compact form factor.The global FC-BGA market was valued at $5.29 billion in 2024 and is projected to grow from $5.82 billion in 2025 to $10.42 billion by 2032, representing a compound annual growth rate (CAGR) of 10.4% during the forecast period. Although FC-BGA has become an essential technology in the next-generation semiconductor market, it continues to face several challenges, including the technical complexity of multilayer substrate manufacturing. At the same time, as chips become larger and more highly integrated, the industry is increasingly in need of alternative solutions capable of overcoming the physical limitations of conventional FC-BGA structures.Overcoming these limitations requires more than incremental process improvements. It calls for a fundamental shift in the structural materials used in package substrates. One of the most promising alternatives attracting industry attention is glass substrate technology, which replaces the organic core used in conventional FC-BGA structures with glass. Compared with organic materials, glass provides superior flatness, enabling finer circuit patterning and making it a highly promising next-generation packaging material.Through these various strategies, FC-BGA continues to overcome its limitations and evolve toward greater levels of performance and integration. Ultimately, it is increasingly regarded not as an option, but as an essential technology in the semiconductor industry.Breaking the Limits of Interconnect Architecture in High-Performance SemiconductorsThe traditional wire bonding method used to connect IC chips to package substrates had inherent limitations, including relatively slow signal transmission speeds and increased electrical resistance. As electronic devices evolved and semiconductor components required higher transmission speeds, heat generation also increased, pushing wire bonding technology toward its physical limits. FC-BGA emerged as an alternative solution to address these challenges.Compared with wire bonding, FC-BGA supports a greater number of interconnections while improving signal transmission speed and signal integrity between the chip and substrate, thereby minimizing transmission loss and latency. Package substrate is typically larger than the chip itself, FC-BGA is widely used in high-performance applications such as AI, PCs, servers, cloud computing, and electric vehicles (EVs). As high-performance semiconductors require an increasing number of input/output (I/O) connections, the importance of FC-BGA continues to grow.LG Innotek’s FC-BGA: From Market Entry to ExpansionRecognizing the growth potential of FC-BGA, LG Innotek made strategic investments to support its full-scale entry into the market.In 2022, the company decided to invest in FC-BGA production facilities and pursued entry into the FC-BGA market by leveraging its advanced package substrate technologies and manufacturing capabilities. As part of this initiative, LG Innotek signed an investment agreement with the city of Gumi in Korea, committed a total investment of 1.4 trillion won at its Gumi site to establish production lines.At CES 2023, where LG Innotek unveiled its FC-BGA products and technologies for the first time, key differentiators included high-density, multilayer, and large-area designs enabled by ultra-fine via technology, as well as warpage reduction technologies utilizing digital transformation (DX) capabilities. The company also showcased FC-BGA technologies in detail through a dedicated substrate zone and offered visitors an interactive experience by allowing them to directly assemble FC-BGA substrate models.Since beginning full-scale FC-BGA mass production in 2024, LG Innotek has been focused on laying the groundwork to enhance its manufacturing competitiveness and support future business expansion. The Dream Factory, an environment optimized for the FC-BGA industry, is a smart manufacturing facility that applies automation, digitalization, and intelligent systems across the entire production process based on advanced IT technologies such as artificial intelligence and deep learning. Built on the Dream Factory,LG Innotek is accelerating the enhancement of its state-of-the-art FC-BGA production infrastructure by minimizing variables that may occur during manufacturing and maximizing process stability.To achieve this, the company introduced an automated logistics system and minimized on-site personnel except for essential staff to enable unmanned operation across the entire production process, thereby helping prevent microscopic defects caused by dust or foreign particles. In addition, AI systems that continuously learn from big data accumulated within the Dream Factory have been applied to quality inspection processes to enhance process reliability and ensure quality control transparency.AI-based automated quality inspection can rapidly detect even microscopic defects that are difficult to identify with the naked eye, further maximizing production efficiency.Going beyond these efforts, LG Innotek plans to introduce an intelligent quality management system capable of detecting, analyzing, and addressing quality anomalies in real time during the production process within the Dream Factory. In addition, the company plans to automate the overall FC-BGA production process through the development of a platform designed to enhance customer responsiveness.The Invisible Difference Behind Performance: Why LG Innotek’s FC-BGA?Built on a production infrastructure optimized for high-performance semiconductor environments, LG Innotek continues to advance its FC-BGA technology.This advanced FC-BGA technology delivers differentiated value to customers by enhancing design flexibility through multilayer, high-density, and large-area structures, while enabling the efficient processing of large volumes of data.• High-Density IntegrationLG Innotek’s FC-BGA enables high-density pattern implementation through fine patterning technology and supports fine vias and high integration through laser drilling and surface treatment technologies. In addition, signal paths that can become increasingly complex as substrates grow larger have been optimized to minimize unnecessary signal delay and interference, while the double side laser drill process, which creates micro-vias from both sides, enables smaller, more precise, and highly integrated circuits. Because even minor alignment errors in microscopic vias can lead to defects, highly precise alignment technology is essential.Furthermore, by utilizing the curing properties of build-up materials, LG Innotek has improved the positional accuracy of embedded silicon dies and implemented ultra-fine designs compatible with chiplet architectures through new processing technologies. This secures stable power delivery, minimizes power noise, and improves overall signal and power integrity across the entire system.• Core Technologies Tailored for Diverse ApplicationsIn addition, precision via processing technology optimized for different substrate thicknesses enables support for large-area designs while minimizing signal loss.Coreless and thin core technologies for slim packaging in laptops and tablets help reduce product thickness and enable shorter signal paths. In contrast, HPC and server semiconductors require thick core structures to accommodate large-area chips, high heat generation, and mechanical stability. This structure helps prevent substrate warpage and provides stable support for large chips. The ability to optimize core structures according to different requirements serves as a differentiated, customer specific design capability of LG Innotek.The Core of Next-Generation Semiconductors: LG Innotek’s Future FC-BGA RoadmapLG Innotek is expanding its presence in the next-generation package substrate market by responding to rapidly evolving industry trends such as the expansion of 5G networks and the growth of the autonomous vehicle market, while keeping pace with increasing demand for FC-BGA. As the AI era accelerates the advancement of high-performance,high-density semiconductors, the importance of next-generation substrate technologies capable of improving package reliability is growing further. Accordingly, glass substrates are emerging as a key solution due to their superior flatness and low thermal deformation compared with conventional package substrates, effectively addressing warpage issues.LG Innotek is also focusing on the development of glass core technology to advance its next-generation substrate capabilities. LG Innotek’s glass core technology implements interlayer electrical connections via through-glass via (TGV) formation and metal plating processes, while forming high-density circuits based on a multi-layer build-up process.The substrate is then finalized into individual packages through circuit patterning and singulation processes, with automation and precision handling technologies applied across the entire production line to achieve both high productivity and quality stability. Through these technologies, the company is further elevating package reliability and performance, solidifying its readiness for the next-generation AI semiconductor market.More recently, LG Innotek has expanded its glass substrate business capabilities through collaboration with UTI, a company with strong competitiveness in the mobile cover glass market. By combining LG Innotek’s 50 years of accumulated substrate material expertise with precision glass processing technology, the company aims to introduce innovative products that deliver differentiated customer value in the next-generation packaging market.LG Innotek is currently broadening its supply of low-end FC-BGA products centered on PC chipsets, while accelerating technology development and production infrastructureadvancement to establish a glass substrate mass production system between 2027 and 2028. Going forward, the company plans to accelerate next-generation package substrate development through collaborations with global technology leaders. Based on this advanced production infrastructure, LG Innotek aims to expand its package solution business to over 3 trillion won by 2030, positioning itself as a key supplier in the future semiconductor packaging market.OutroFC-BGA is a key infrastructure technology in the era of high-performance semiconductors and is expected to remain in the spotlight in the years ahead. In line with this trend, LG Innotek is well-positioned to lead shifts in the semiconductor market through its accumulated technological expertise and proactive investments across multiple areas.In a semiconductor market where technical requirements continue to rise rapidly, LG Innotek stands as a trusted partner delivering competitive solutions for the future.
