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Products 구분점 Substrate & Material
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Substrate & Material

Package Substrate
It is used to transmit electrical signals between the semiconductor and the main board.
It is used in all products that use electricity as a part and is High-density circuit board on which circuits are formed
Tape Substrate
It is thin tape-type substrate that form signal connection between the display Driver-IC and the panel
Display Mask
It is the Photomask for display manufacturing exposure process , and also used as a deposition mask for OLED Pixel implementation

Package Substrate

FC-BGA
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테이블 이미지
RF-SiP
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테이블 이미지
AiP
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테이블 이미지
FCCSP
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테이블 이미지
CSP
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테이블 이미지

Tape Substrate

COF
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테이블 이미지
2Metal COF
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테이블 이미지
COB
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테이블 이미지

Display Mask

OLED Mask
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테이블 이미지
Photomask
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테이블 이미지
01

Package Substrate

  • Fine pattern and via processing technology
    Fine pattern and via processing technology

    - A high-density pattern can be realized through the fine panning method, and a highly integrated substrate can be realized by forming a micro-via using a laser drill.
    - Improved product design freedom through substrate miniaturization
    - Promoting advancement of laser drill processing technology

  • Coreless technology
    Coreless technology

    - By lowering the number of layers of the substrate by not using the core (CCL) of the substrate It is possible to realize a high multi-layer and ultra-thin substrate.
    - Even/Odd Layer both can be designed
    - Beneficial for realization of high multi-layer thin structure
    - It is possible to implement BVH in all layers, and it is advantageous for high-density via count application

  • Ultra-thin/low-loss substrate implementation technology
    Ultra-thin/low-loss substrate implementation technology

    - By lowering the thickness and dielectric constant of the insulating layer (Dielectric), the thickness of the substrate is reduced and RF signal loss is minimized.
    - Reduction of insulation layer thickness by applying RCC/PPG hybrid structure and improved RF performance

  • Signal loss reduction technology
    Signal loss reduction technology

    - By reducing the roughness of the circuit (Cu) surface of the substrate through chemical surface treatment to minimize signal loss
    - Improves the performance of RF modules.
    - Ra 0.6㎛ → 0.2㎛

  • Embedded technology
    Embedded technology

    - EPS (Embedded Passive Substrate)
    : Signal noise occurs as the semiconductor signal speed increases. It controls signal noise by embedding passive elements inside the board.
    - EDS (Embedded Die Substrate)
    : This is a technology to improve signal speed, heat dissipation, and reduce package size (X, Y, Z axes) by embedding semiconductor components directly into the board.

  • Cu Post Technology
    Cu Post Technology

    - Existing Solder Ball method by reducing bump/ball pitch Alternative plating technology.
    - Post advantage is reduced package XY axis size to increase part section leader rate
    - It has high thermal conductivity compared to soldering, so the heat dissipation characteristics are improved. can be maximized.

  • Bridge Pattering Technology
    Bridge Pattering Technology

    - As the size of semiconductor parts increases due to the increase in data such as 5G, Big Data, and AI The price of semiconductor components will increase.
    - Chiplet technology that divides the functions of semiconductor parts to reduce the price of parts Introduced, Bridge Pattering forming technology that connects chip to chip Required.

  • Thermal Stress Control Technology
    Thermal Stress Control Technology

    - Thermal stress due to difference in thermal expansion coefficient between dissimilar materials Problems affect product reliability.
    - Thermal stress prediction and control through simulation
    - Provides thermal stress solution through material combination and design optimization

  • Plating thickness and control technology
    Plating thickness and control technology

    - Determination of optimum process conditions by checking the quality of the plating thickness before inputting the process Minimize development loss

  • Various core thickness application technology
    Various core thickness application technology

    - Various package thicknesses can be implemented depending on the product use.
    - Thin core application technology to realize slim package for laptop and tablet
    - Thick core application technology for realizing thick packages for HPC and servers

  • Fine Pattern / Fine Via hole processing technology
    Fine Pattern / Fine Via hole processing technology

    - High-density board integration is possible through miniaturization of patterns and via holes according to product high-end specifications.
    - High multi-layer / large area applied to high-performance package through SAP (Semi-Additive Process) method Micro-circuit implementation technology for products
    - Realization of fine via using laser drill and high integration of holes

  • Fine Bump (SOP) Technology
    Fine Bump (SOP) Technology

    - As the I/O (Input / Output) Count increases for high performance and more signal transmission, the demand for miniaturization of bumps on the board increases and there is.
    - Bump pitch miniaturization technology for high-performance products

  • Warpage control technology for flatness
    Warpage control technology for flatness

    - In order to maintain flatness in the package section leader, warpage prediction and control technology through simulation is required.
    - Warpage prediction and control through simulation
    - Provision of warpage improvement solution to alleviate the degree of warpage of the substrate

01

Package Substrate

Fine pattern and via processing technology
Fine pattern and via processing technology

- A high-density pattern can be realized through the fine panning method, and a highly integrated substrate can be realized by forming a micro-via using a laser drill.
- Improved product design freedom through substrate miniaturization
- Promoting advancement of laser drill processing technology

Coreless technology
Coreless technology

- By lowering the number of layers of the substrate by not using the core (CCL) of the substrate It is possible to realize a high multi-layer and ultra-thin substrate.
- Even/Odd Layer both can be designed
- Beneficial for realization of high multi-layer thin structure
- It is possible to implement BVH in all layers, and it is advantageous for high-density via count application

Ultra-thin/low-loss substrate implementation technology
Ultra-thin/low-loss substrate implementation technology

- By lowering the thickness and dielectric constant of the insulating layer (Dielectric), the thickness of the substrate is reduced and RF signal loss is minimized.
- Reduction of insulation layer thickness by applying RCC/PPG hybrid structure and improved RF performance

Signal loss reduction technology
Signal loss reduction technology

- By reducing the roughness of the circuit (Cu) surface of the substrate through chemical surface treatment to minimize signal loss
- Improves the performance of RF modules.
- Ra 0.6㎛ → 0.2㎛

Embedded technology
Embedded technology

- EPS (Embedded Passive Substrate)
: Signal noise occurs as the semiconductor signal speed increases. It controls signal noise by embedding passive elements inside the board.
- EDS (Embedded Die Substrate)
: This is a technology to improve signal speed, heat dissipation, and reduce package size (X, Y, Z axes) by embedding semiconductor components directly into the board.

Cu Post Technology
Cu Post Technology

- Existing Solder Ball method by reducing bump/ball pitch Alternative plating technology.
- Post advantage is reduced package XY axis size to increase part section leader rate
- It has high thermal conductivity compared to soldering, so the heat dissipation characteristics are improved. can be maximized.

Bridge Pattering Technology
Bridge Pattering Technology

- As the size of semiconductor parts increases due to the increase in data such as 5G, Big Data, and AI The price of semiconductor components will increase.
- Chiplet technology that divides the functions of semiconductor parts to reduce the price of parts Introduced, Bridge Pattering forming technology that connects chip to chip Required.

Thermal Stress Control Technology
Thermal Stress Control Technology

- Thermal stress due to difference in thermal expansion coefficient between dissimilar materials Problems affect product reliability.
- Thermal stress prediction and control through simulation
- Provides thermal stress solution through material combination and design optimization

Plating thickness and control technology
Plating thickness and control technology

- Determination of optimum process conditions by checking the quality of the plating thickness before inputting the process Minimize development loss

Various core thickness application technology
Various core thickness application technology

- Various package thicknesses can be implemented depending on the product use.
- Thin core application technology to realize slim package for laptop and tablet
- Thick core application technology for realizing thick packages for HPC and servers

Fine Pattern / Fine Via hole processing technology
Fine Pattern / Fine Via hole processing technology

- High-density board integration is possible through miniaturization of patterns and via holes according to product high-end specifications.
- High multi-layer / large area applied to high-performance package through SAP (Semi-Additive Process) method Micro-circuit implementation technology for products
- Realization of fine via using laser drill and high integration of holes

Fine Bump (SOP) Technology
Fine Bump (SOP) Technology

- As the I/O (Input / Output) Count increases for high performance and more signal transmission, the demand for miniaturization of bumps on the board increases and there is.
- Bump pitch miniaturization technology for high-performance products

Warpage control technology for flatness
Warpage control technology for flatness

- In order to maintain flatness in the package section leader, warpage prediction and control technology through simulation is required.
- Warpage prediction and control through simulation
- Provision of warpage improvement solution to alleviate the degree of warpage of the substrate

02

Tape Substrate

  • Fine Patterning & Via Implementation Technology
    Fine Patterning & Via Implementation Technology

    - Display It is a core part for display that transmits electrical signals to drive each pixel. It connects the Drive IC Section Leader and Panel with the Main Board Allows the screen to be controlled. By reducing the circuit pitch through flexible single-sided / double-sided fine patterning technology, we have the technology to realize the high-resolution display that customers want, and to reduce the chip size & narrow bezel.
    - Implementation of multi-channel double-sided patterning through Micro Via Hole processing method
    - Display Narrow Bezel by securing high bending performance
    - Module slimming possible by implementing ultra-small & slim substrate

  • High Quality Roll to Roll Process
    High Quality Roll to Roll Process

    - Applying the roll to roll method of non-touch method between facilities/products, It is possible to manufacture high-reliability/high-quality substrates with high productivity.
    - Realization of high-quality products through uniform process capability control
    - Securing high-quality product reliability through full auto optical/electrical inspection

  • Various Technical Solutions
    Various Technical Solutions

    - We have optimized material/patterning/surface treatment technology for each application (Display & Smart IC, etc.) and provide various values to customers.

03

Tape Substrate

Fine Patterning & Via Implementation Technology
Fine Patterning & Via Implementation Technology

- Display It is a core part for display that transmits electrical signals to drive each pixel. It connects the Drive IC Section Leader and Panel with the Main Board Allows the screen to be controlled. By reducing the circuit pitch through flexible single-sided / double-sided fine patterning technology, we have the technology to realize the high-resolution display that customers want, and to reduce the chip size & narrow bezel.
- Implementation of multi-channel double-sided patterning through Micro Via Hole processing method
- Display Narrow Bezel by securing high bending performance
- Module slimming possible by implementing ultra-small & slim substrate

High Quality Roll to Roll Process
High Quality Roll to Roll Process

- Applying the roll to roll method of non-touch method between facilities/products, It is possible to manufacture high-reliability/high-quality substrates with high productivity.
- Realization of high-quality products through uniform process capability control
- Securing high-quality product reliability through full auto optical/electrical inspection

Various Technical Solutions
Various Technical Solutions

- We have optimized material/patterning/surface treatment technology for each application (Display & Smart IC, etc.) and provide various values to customers.

03

Display Mask

  • Fine Metal Mask
    Fine Metal Mask

    - This is a mask used to selectively deposit organic light emitting materials on the substrate. By applying high-resolution photolitho method and thin plate material, customer requirements are met. We provide a variety of pattern shapes and quality customization services.
    - Realization of fine pattern applied with photo resist for high resolution (Space 2um)
    - Improved Shadow Effect quality by implementing Low Step Height/Width (Under 2um)
    - Line up: 4.5G, 6G Mobile, Wide IT, Automotive model, Fine Metal Mask for next-generation 8.5G in development

  • Fine Metal Mask : Simulation Technology
    Fine Metal Mask : Simulation Technology

    - 3D hole diameter structure prediction Etching simulation technology: Through etching simulation technology, it is possible to quickly and accurately design the hole diameter structure by predicting it in 3D shape.
    - Tensile deformation prediction simulation: product development by reflecting customer’s tensile properties through tensile deformation prediction simulation according to etching structure

  • Display Photomask
    Display Photomask

    - It is a plate for exposure engraved with microcircuits on a transparent substrate (Quarts), which enables the formation of circuits and patterns for the realization of high-resolution flat panel displays (OLED/LCD, etc.) through selective transmission of light in the exposure process.
    - Premium Mask response technology: Tone control technology and special mask : Half Tone Mask, Multi Tone Mask, Phase Shift Mask
    - Ultra-precision pattern implementation technology Display Fab. Establishment of line capable of responding to all generations (~10.5G) Excellent quality and SCM competitiveness through internalization of raw material technology: Quartz Polishing, Thin Film Sputtering

03

Display Mask

Fine Metal Mask
Fine Metal Mask

- This is a mask used to selectively deposit organic light emitting materials on the substrate. By applying high-resolution photolitho method and thin plate material, customer requirements are met. We provide a variety of pattern shapes and quality customization services.
- Realization of fine pattern applied with photo resist for high resolution (Space 2um)
- Improved Shadow Effect quality by implementing Low Step Height/Width (Under 2um)
- Line up: 4.5G, 6G Mobile, Wide IT, Automotive model, Fine Metal Mask for next-generation 8.5G in development

Fine Metal Mask : Simulation Technology
Fine Metal Mask : Simulation Technology

- 3D hole diameter structure prediction Etching simulation technology: Through etching simulation technology, it is possible to quickly and accurately design the hole diameter structure by predicting it in 3D shape.
- Tensile deformation prediction simulation: product development by reflecting customer’s tensile properties through tensile deformation prediction simulation according to etching structure

Display Photomask
Display Photomask

- It is a plate for exposure engraved with microcircuits on a transparent substrate (Quarts), which enables the formation of circuits and patterns for the realization of high-resolution flat panel displays (OLED/LCD, etc.) through selective transmission of light in the exposure process.
- Premium Mask response technology: Tone control technology and special mask : Half Tone Mask, Multi Tone Mask, Phase Shift Mask
- Ultra-precision pattern implementation technology Display Fab. Establishment of line capable of responding to all generations (~10.5G) Excellent quality and SCM competitiveness through internalization of raw material technology: Quartz Polishing, Thin Film Sputtering