Package Substrate

Substrate & Material RF-SiP Radio Frequency-System in Package Applicable products

RF-SiP is a package substrate that combined an RF, logic chip, and passive element into one system.

Value proposition / Competitiveness

01 It allows for an even- or odd-layer design and increases the degree of freedom in design.
02 It realizes a multi-layer thin structure.
03 Buried Via Hole (BVH) can be applied to all layers and is suitable for high-density Vias.