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Mobility Solution

Connectivity Solution
A communication module for vehicles that supports international communication standards and enables wireless data communication between vehicles and objects for autonomous driving
Autonomous Driving Solution
Sensor parts that can provide safety and convenience to drivers/occupants by accurately recognizing internal/external information such as cameras and radars
Electrification Solution
Power modules such as DC-DC converters, battery management systems and charge control modules, which are key parts of eco-friendly vehicles, and small motors / power packs advanced with electrification
Lighting Solution
Lighting module with differentiated structure and technology to respond to vehicle lamp design trends and customer needs.
Smart Home Solution​
High‑speed communication and high‑efficiency power modules required to implement smart home services that connect TVs, home appliances, and IoT devices to the cloud.

Autonomous Driving Solution

Automotive Camera
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Radar
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Autonomous Driving Camera
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Built-In Heating Camera
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Driver Monitoring Camera
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Occupant Monitoring Camera
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Gesture Control Camera
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Electrification Solution

EVSE (Electric Vehicle Supply Equipment)
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EVCC(Electric Vehicle Communication Controller)
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BMS(Battery Management System)
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Power Control Module
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OPU (Oil Pump Control Unit)
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ATC ECU (Active Transfer Case)
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Powerpack
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EPS Motor
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EHB Motor
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Connectivity Solution

UWB Digital Key System
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AP Module
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5G Module
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Bluetooth® / Wi-Fi Module
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Lighting Solution

Nexlide A
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Nexlide M
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NEXTEM
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Smart Home Solution

PSU (TV/Monitor)
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Slim PSU (OLED TV)
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Bluetooth® Low Energy Dongle
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PoE
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Smart Home Wi-Fi Module
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01

Autonomous Driving Solution

  • Continuing to lead the market by developing differentiated products by possessing high-performance lens/mold design capabilities, which are core technologies in line with the trend of high-resolution and high-performance smartphone cameras, and building an evaluation system
    Continuing to lead the market by developing differentiated products by possessing high-performance lens/mold design capabilities, which are core technologies in line with the trend of high-resolution and high-performance smartphone cameras, and building an evaluation system

    - High resolution lens/mold design
    : High-definition realization and minimal tolerance sensitivity between lenses by applying 7P or higher lenses, High-performance optical system design to improve low-light brightness and reduce distortion, Ultra-precision mold design technology to minimize lens optical axis distortion, Using various analysis tools and analyzing the causes of Ghost and Flare through cross-analysis and designing avoidance
    - Slim lens / mold design
    : Possessing next-generation optical system design technology, such as freeform lenses to shorten the TTL of high-performance lenses
    - Multi-group lens / mold design for continuous zoom
    : Multi-group lens design with changing focal length for magnification change, Implementation of precise alignment technology between lens groups to secure continuous zoom lens performance, With its own D-cut lens design, slim module height is realized and brightness is maintained even at high magnification.
    - Reinforcement of lens environmental resistance (Automotive)
    : Applying LG Innotek's patented lens heating structure to quickly remove frost or moisture on the lens surface due to environmental changes such as weather and temperature

  • With the world's best simulation system and high-precision design technology, we design reliable modules for stable use in any situation
    With the world's best simulation system and high-precision design technology, we design reliable modules for stable use in any situation

    - Drop Simulation: Through virtual drop test to maintain uniform performance and guarantee reliability Analyze the amount of impact and change received by each part and reflect it in the design
    - Temperature simulation: Prediction of temperature change over time to minimize the risk of defects caused by heat during long-term shooting
    - Modular structure analysis: Optimize the design by predicting variables between processes such as shrinkage of epoxy used for assembly and changes in lens and actuator structure during module manufacturing
    - Lens/device flow analysis: In the lens mold, the quality risk according to the mold flow of the lens material is recognized in advance, and the design is reflected and the deformation amount of the injection device is predicted to select the optimal location

  • Optimized for smartphones, XR devices, vehicles, etc. of the camera module through ultra-precision/miniaturization design capabilities Performance and durability are maintained and the module size has been reduced.
    Optimized for smartphones, XR devices, vehicles, etc. of the camera module through ultra-precision/miniaturization design capabilities Performance and durability are maintained and the module size has been reduced.

    - Ultra-small packaging and method: miniaturization and slimming of precision packaging-based modules such as COB, Flipchip, and Cavity PCB
    - Compact design-based vehicle camera module miniaturization : Minimize size through integrated structure design, minimize the number of parts through ultrasonic welding method

  • We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
    We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

    - High-precision Active Alignment: Based on image information, by precisely adjusting the lens position for optical center & tilt correction to ensure optimized optical performance and minimize defects, high-performance camera (Zoom / OIS), ultra-wide-angle camera, and multi-camera alignment technology
    - Various packaging process technologies: COB (Chip on Board), CSP (Chip Scale Package), and Flip-chip, responding to a wide range of packaging processes and establishing a mass production system
    - DX-based process automation: Implementation of smart factory through DX (Digital Transformation)-based automation system in all areas including production process and quality management

  • We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
    We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

    - High-precision Active Alignment: Based on image information, by precisely adjusting the lens position for optical center & tilt correction to ensure optimized optical performance and minimize defects, high-performance camera (Zoom / OIS), ultra-wide-angle camera, and multi-camera alignment technology
    - Various packaging process technologies: COB (Chip on Board), CSP (Chip Scale Package), and Flip-chip, responding to a wide range of packaging processes and establishing a mass production system
    - DX-based process automation: Implementation of smart factory through DX (Digital Transformation)-based automation system in all areas including production process and quality management

01

Autonomous Driving Solution

Continuing to lead the market by developing differentiated products by possessing high-performance lens/mold design capabilities, which are core technologies in line with the trend of high-resolution and high-performance smartphone cameras, and building an evaluation system
Continuing to lead the market by developing differentiated products by possessing high-performance lens/mold design capabilities, which are core technologies in line with the trend of high-resolution and high-performance smartphone cameras, and building an evaluation system

- High resolution lens/mold design
: High-definition realization and minimal tolerance sensitivity between lenses by applying 7P or higher lenses, High-performance optical system design to improve low-light brightness and reduce distortion, Ultra-precision mold design technology to minimize lens optical axis distortion, Using various analysis tools and analyzing the causes of Ghost and Flare through cross-analysis and designing avoidance
- Slim lens / mold design
: Possessing next-generation optical system design technology, such as freeform lenses to shorten the TTL of high-performance lenses
- Multi-group lens / mold design for continuous zoom
: Multi-group lens design with changing focal length for magnification change, Implementation of precise alignment technology between lens groups to secure continuous zoom lens performance, With its own D-cut lens design, slim module height is realized and brightness is maintained even at high magnification.
- Reinforcement of lens environmental resistance (Automotive)
: Applying LG Innotek's patented lens heating structure to quickly remove frost or moisture on the lens surface due to environmental changes such as weather and temperature

With the world's best simulation system and high-precision design technology, we design reliable modules for stable use in any situation
With the world's best simulation system and high-precision design technology, we design reliable modules for stable use in any situation

- Drop Simulation: Through virtual drop test to maintain uniform performance and guarantee reliability Analyze the amount of impact and change received by each part and reflect it in the design
- Temperature simulation: Prediction of temperature change over time to minimize the risk of defects caused by heat during long-term shooting
- Modular structure analysis: Optimize the design by predicting variables between processes such as shrinkage of epoxy used for assembly and changes in lens and actuator structure during module manufacturing
- Lens/device flow analysis: In the lens mold, the quality risk according to the mold flow of the lens material is recognized in advance, and the design is reflected and the deformation amount of the injection device is predicted to select the optimal location

Optimized for smartphones, XR devices, vehicles, etc. of the camera module through ultra-precision/miniaturization design capabilities Performance and durability are maintained and the module size has been reduced.
Optimized for smartphones, XR devices, vehicles, etc. of the camera module through ultra-precision/miniaturization design capabilities Performance and durability are maintained and the module size has been reduced.

- Ultra-small packaging and method: miniaturization and slimming of precision packaging-based modules such as COB, Flipchip, and Cavity PCB
- Compact design-based vehicle camera module miniaturization : Minimize size through integrated structure design, minimize the number of parts through ultrasonic welding method

We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

- High-precision Active Alignment: Based on image information, by precisely adjusting the lens position for optical center & tilt correction to ensure optimized optical performance and minimize defects, high-performance camera (Zoom / OIS), ultra-wide-angle camera, and multi-camera alignment technology
- Various packaging process technologies: COB (Chip on Board), CSP (Chip Scale Package), and Flip-chip, responding to a wide range of packaging processes and establishing a mass production system
- DX-based process automation: Implementation of smart factory through DX (Digital Transformation)-based automation system in all areas including production process and quality management

We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

- High-precision Active Alignment: Based on image information, by precisely adjusting the lens position for optical center & tilt correction to ensure optimized optical performance and minimize defects, high-performance camera (Zoom / OIS), ultra-wide-angle camera, and multi-camera alignment technology
- Various packaging process technologies: COB (Chip on Board), CSP (Chip Scale Package), and Flip-chip, responding to a wide range of packaging processes and establishing a mass production system
- DX-based process automation: Implementation of smart factory through DX (Digital Transformation)-based automation system in all areas including production process and quality management

02

Electrification Solution

  • Automotive ECU S/W Design
    Automotive ECU S/W Design

    - Various solutions are provided by designing and optimizing S/W according to the AUTOSAR platform structure and process, which is the standard system for vehicle ECU S/W, and can provide not only AUTOSAR but also its own platform-based solutions
    - BSW (Basic Software), RTE (Run-Time Environment) optimization: Service / ECU Abstraction Layer, MCAL (Microcontroller Abstraction Layer), Complex Driver
    - S/W design optimization: model-based design, power control, battery management, electric vehicle charging control algorithm

  • International standard/process applied product development
    International standard/process applied product development

    - We are developing products by applying the standard process ASPICE for vehicle ECU system and S/W quality, the international standard for functional safety ISO26262, and the cyber security standard ISO21434.
    - ASPICE: Process capability evaluation, system and S/W quality management
    - Functional Safety (ISO26262): Safety Mechanism Design, Technical Safety Concept, Safety Analysis, Dependent Failure Analysis (DFA)
    - Cyber Security (ISO21434): Threat Analysis and Risk Assessment (TARA), Security Engineering

  • Compact Design
    Compact Design

    - By applying high-performance magnets based on LG Innotek's proprietary patents and optimizing the rotor and stator combination, a compact and lightweight motor design can be achieved.
    - Application of High-Performance Magnets with Reduced Heavy Rare Earth Content
    - Optimal Electromagnetic Design of Rotor and Stator

  • Integrated Motor & Controller Design
    Integrated Motor & Controller Design

    - Based on design technology that controls motor output tailored to the system, we combine the motor and controller into an optimized structure, delivering a compact and lightweight power pack.
    - Optimized Design of the Integrated Structure (Fluid / Electromagnetic Field / Mechanical Structure)

  • Diverse Integrated Module Design
    Diverse Integrated Module Design

    - We can flexibly respond to the integration demands of eco-friendly vehicle components, enabling extended driving range and simplification of both system design and assembly processes.
    - Integrated Control Circuit Design

02

Electrification Solution

Automotive ECU S/W Design
Automotive ECU S/W Design

- Various solutions are provided by designing and optimizing S/W according to the AUTOSAR platform structure and process, which is the standard system for vehicle ECU S/W, and can provide not only AUTOSAR but also its own platform-based solutions
- BSW (Basic Software), RTE (Run-Time Environment) optimization: Service / ECU Abstraction Layer, MCAL (Microcontroller Abstraction Layer), Complex Driver
- S/W design optimization: model-based design, power control, battery management, electric vehicle charging control algorithm

International standard/process applied product development
International standard/process applied product development

- We are developing products by applying the standard process ASPICE for vehicle ECU system and S/W quality, the international standard for functional safety ISO26262, and the cyber security standard ISO21434.
- ASPICE: Process capability evaluation, system and S/W quality management
- Functional Safety (ISO26262): Safety Mechanism Design, Technical Safety Concept, Safety Analysis, Dependent Failure Analysis (DFA)
- Cyber Security (ISO21434): Threat Analysis and Risk Assessment (TARA), Security Engineering

Compact Design
Compact Design

- By applying high-performance magnets based on LG Innotek's proprietary patents and optimizing the rotor and stator combination, a compact and lightweight motor design can be achieved.
- Application of High-Performance Magnets with Reduced Heavy Rare Earth Content
- Optimal Electromagnetic Design of Rotor and Stator

Integrated Motor & Controller Design
Integrated Motor & Controller Design

- Based on design technology that controls motor output tailored to the system, we combine the motor and controller into an optimized structure, delivering a compact and lightweight power pack.
- Optimized Design of the Integrated Structure (Fluid / Electromagnetic Field / Mechanical Structure)

Diverse Integrated Module Design
Diverse Integrated Module Design

- We can flexibly respond to the integration demands of eco-friendly vehicle components, enabling extended driving range and simplification of both system design and assembly processes.
- Integrated Control Circuit Design

03

Connectivity Solution

  • H/W and S/W platform design
    H/W and S/W platform design

    - Based on H/W and S/W platform design, it supports the latest international standards and provides communication modules optimized for various systems.
    - Differentiated RF circuit design: Optimization of radio wave transmission and reception Ultra-precision / high-integration module design: miniaturization, improved reliability and compatibility Support for the latest communication standards and differentiated S/W integration middleware

  • Communication technology for autonomous driving
    Communication technology for autonomous driving

    - Provides a solution that can implement safety and convenience functions through technologies such as vehicle-to-vehicle communication (V2X), high-precision positioning, and high-speed interface that can deliver accurate and fast information for the advancement of the autonomous driving stage
    - DSRC, Cellular-based Hybrid V2X support simultaneously
    - Vehicle communication near/far high precision positioning solution
    - Next-generation vehicle high-speed communication interface (MIPI A-PHY, HDBaseT) solution

  • mmWave antenna design and signal processing
    mmWave antenna design and signal processing

    - Provides a radar solution capable of high-resolution and long-distance detection by optimizing the antenna structure design, signal processing and recognition S/W of mmWave band.
    - Multi Array antenna structure design, mmWave RF matching technology
    - High resolution / High SNR (Signal to Noise Ratio) signal processing S/W
    - Provide cognitive S/W that can respond to the advancement of the autonomous driving stage

03

Connectivity Solution

H/W and S/W platform design
H/W and S/W platform design

- Based on H/W and S/W platform design, it supports the latest international standards and provides communication modules optimized for various systems.
- Differentiated RF circuit design: Optimization of radio wave transmission and reception Ultra-precision / high-integration module design: miniaturization, improved reliability and compatibility Support for the latest communication standards and differentiated S/W integration middleware

Communication technology for autonomous driving
Communication technology for autonomous driving

- Provides a solution that can implement safety and convenience functions through technologies such as vehicle-to-vehicle communication (V2X), high-precision positioning, and high-speed interface that can deliver accurate and fast information for the advancement of the autonomous driving stage
- DSRC, Cellular-based Hybrid V2X support simultaneously
- Vehicle communication near/far high precision positioning solution
- Next-generation vehicle high-speed communication interface (MIPI A-PHY, HDBaseT) solution

mmWave antenna design and signal processing
mmWave antenna design and signal processing

- Provides a radar solution capable of high-resolution and long-distance detection by optimizing the antenna structure design, signal processing and recognition S/W of mmWave band.
- Multi Array antenna structure design, mmWave RF matching technology
- High resolution / High SNR (Signal to Noise Ratio) signal processing S/W
- Provide cognitive S/W that can respond to the advancement of the autonomous driving stage

04

Lighting Solution

  • High-efficiency structure and optical pattern design
    High-efficiency structure and optical pattern design

    - This is a lamp module that can provide an optimized design structure in line with vehicle lamp design trends. With LG Innotek's unique high-efficiency structure and optical and pattern design technology, it is possible to achieve a uniform luminous image and a slim design.
    - High efficiency structure: Minimize the number of LEDs
    - Optical: resin coating / curing
    - Pattern: Micro-pattern application and lamination

04

Lighting Solution

High-efficiency structure and optical pattern design
High-efficiency structure and optical pattern design

- This is a lamp module that can provide an optimized design structure in line with vehicle lamp design trends. With LG Innotek's unique high-efficiency structure and optical and pattern design technology, it is possible to achieve a uniform luminous image and a slim design.
- High efficiency structure: Minimize the number of LEDs
- Optical: resin coating / curing
- Pattern: Micro-pattern application and lamination

05

Smart Home Solution

  • Antenna Performance Verification (Simulation / Measurement)
    Antenna Performance Verification (Simulation / Measurement)

    - Antenna Location / Performance Simulation

05

Smart Home Solution

Antenna Performance Verification (Simulation / Measurement)
Antenna Performance Verification (Simulation / Measurement)

- Antenna Location / Performance Simulation

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