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Optics Solution
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Products 구분점 Optics Solution
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Optics Solution

Camera Module
High-performance/multi-function camera module that maximizes user convenience through various functions such as high-definition shooting, auto focus, image stabilization, wide-angle shooting, and high-magnification optical zoom
3D Sensing Module
A module that extracts a three-dimensional depth map by measuring the distance from the photographer to a specific object or point
Actuator
A driving part that performs the AF for precise focusing in the camera module, OIS for correcting shake, and the zoom function for magnified photography

Camera Module

Wide Camera
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테이블 이미지
Optical Zoom Camera
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테이블 이미지
Ultra Wide Camera
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테이블 이미지
Front Camera
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테이블 이미지
Viewing Camera
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테이블 이미지
Sensing Camera
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테이블 이미지
Imaging Camera
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테이블 이미지
Automotive Camera
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테이블 이미지

3D Sensing Module

ToF Module
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테이블 이미지

Actuator

Actuator
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테이블 이미지
01

Camera Module

  • Continuing to lead the market by developing differentiated products by possessing high-performance lens/mold design capabilities, which are core technologies in line with the trend of high-resolution and high-performance smartphone cameras, and building an evaluation system
    Continuing to lead the market by developing differentiated products by possessing high-performance lens/mold design capabilities, which are core technologies in line with the trend of high-resolution and high-performance smartphone cameras, and building an evaluation system

    - High resolution lens/mold design
    : High-definition realization and minimal tolerance sensitivity between lenses by applying 7P or higher lenses, High-performance optical system design to improve low-light brightness and reduce distortion, Ultra-precision mold design technology to minimize lens optical axis distortion, Using various analysis tools and analyzing the causes of Ghost and Flare through cross-analysis and designing avoidance
    - Slim lens / mold design
    : Possessing next-generation optical system design technology, such as freeform lenses to shorten the TTL of high-performance lenses
    - Multi-group lens / mold design for continuous zoom
    : Multi-group lens design with changing focal length for magnification change, Implementation of precise alignment technology between lens groups to secure continuous zoom lens performance, With its own D-cut lens design, slim module height is realized and brightness is maintained even at high magnification.
    - Reinforcement of lens environmental resistance (Automotive)
    : Applying LG Innotek's patented lens heating structure to quickly remove frost or moisture on the lens surface due to environmental changes such as weather and temperature

  • With the world's best simulation system and high-precision design technology, we design reliable modules for stable use in any situation
    With the world's best simulation system and high-precision design technology, we design reliable modules for stable use in any situation

    - Drop Simulation: Through virtual drop test to maintain uniform performance and guarantee reliability Analyze the amount of impact and change received by each part and reflect it in the design
    - Temperature simulation: Prediction of temperature change over time to minimize the risk of defects caused by heat during long-term shooting
    - Modular structure analysis: Optimize the design by predicting variables between processes such as shrinkage of epoxy used for assembly and changes in lens and actuator structure during module manufacturing
    - Lens/device flow analysis: In the lens mold, the quality risk according to the mold flow of the lens material is recognized in advance, and the design is reflected and the deformation amount of the injection device is predicted to select the optimal location

  • Optimized for smartphones, XR devices, vehicles, etc. of the camera module through ultra-precision/miniaturization design capabilities Performance and durability are maintained and the module size has been reduced.
    Optimized for smartphones, XR devices, vehicles, etc. of the camera module through ultra-precision/miniaturization design capabilities Performance and durability are maintained and the module size has been reduced.

    - Ultra-small packaging and method: miniaturization and slimming of precision packaging-based modules such as COB, Flipchip, and Cavity PCB
    - Compact design-based vehicle camera module miniaturization : Minimize size through integrated structure design, minimize the number of parts through ultrasonic welding method

  • We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
    We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

    - High-precision Active Alignment: Based on image information, by precisely adjusting the lens position for optical center & tilt correction to ensure optimized optical performance and minimize defects, high-performance camera (Zoom / OIS), ultra-wide-angle camera, and multi-camera alignment technology
    - Various packaging process technologies: COB (Chip on Board), CSP (Chip Scale Package), and Flip-chip, responding to a wide range of packaging processes and establishing a mass production system
    - DX-based process automation: Implementation of smart factory through DX (Digital Transformation)-based automation system in all areas including production process and quality management

  • We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
    We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

    - High-precision Active Alignment: Based on image information, by precisely adjusting the lens position for optical center & tilt correction to ensure optimized optical performance and minimize defects, high-performance camera (Zoom / OIS), ultra-wide-angle camera, and multi-camera alignment technology
    - Various packaging process technologies: COB (Chip on Board), CSP (Chip Scale Package), and Flip-chip, responding to a wide range of packaging processes and establishing a mass production system
    - DX-based process automation: Implementation of smart factory through DX (Digital Transformation)-based automation system in all areas including production process and quality management

01

Camera Module

Continuing to lead the market by developing differentiated products by possessing high-performance lens/mold design capabilities, which are core technologies in line with the trend of high-resolution and high-performance smartphone cameras, and building an evaluation system
Continuing to lead the market by developing differentiated products by possessing high-performance lens/mold design capabilities, which are core technologies in line with the trend of high-resolution and high-performance smartphone cameras, and building an evaluation system

- High resolution lens/mold design
: High-definition realization and minimal tolerance sensitivity between lenses by applying 7P or higher lenses, High-performance optical system design to improve low-light brightness and reduce distortion, Ultra-precision mold design technology to minimize lens optical axis distortion, Using various analysis tools and analyzing the causes of Ghost and Flare through cross-analysis and designing avoidance
- Slim lens / mold design
: Possessing next-generation optical system design technology, such as freeform lenses to shorten the TTL of high-performance lenses
- Multi-group lens / mold design for continuous zoom
: Multi-group lens design with changing focal length for magnification change, Implementation of precise alignment technology between lens groups to secure continuous zoom lens performance, With its own D-cut lens design, slim module height is realized and brightness is maintained even at high magnification.
- Reinforcement of lens environmental resistance (Automotive)
: Applying LG Innotek's patented lens heating structure to quickly remove frost or moisture on the lens surface due to environmental changes such as weather and temperature

With the world's best simulation system and high-precision design technology, we design reliable modules for stable use in any situation
With the world's best simulation system and high-precision design technology, we design reliable modules for stable use in any situation

- Drop Simulation: Through virtual drop test to maintain uniform performance and guarantee reliability Analyze the amount of impact and change received by each part and reflect it in the design
- Temperature simulation: Prediction of temperature change over time to minimize the risk of defects caused by heat during long-term shooting
- Modular structure analysis: Optimize the design by predicting variables between processes such as shrinkage of epoxy used for assembly and changes in lens and actuator structure during module manufacturing
- Lens/device flow analysis: In the lens mold, the quality risk according to the mold flow of the lens material is recognized in advance, and the design is reflected and the deformation amount of the injection device is predicted to select the optimal location

Optimized for smartphones, XR devices, vehicles, etc. of the camera module through ultra-precision/miniaturization design capabilities Performance and durability are maintained and the module size has been reduced.
Optimized for smartphones, XR devices, vehicles, etc. of the camera module through ultra-precision/miniaturization design capabilities Performance and durability are maintained and the module size has been reduced.

- Ultra-small packaging and method: miniaturization and slimming of precision packaging-based modules such as COB, Flipchip, and Cavity PCB
- Compact design-based vehicle camera module miniaturization : Minimize size through integrated structure design, minimize the number of parts through ultrasonic welding method

We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

- High-precision Active Alignment: Based on image information, by precisely adjusting the lens position for optical center & tilt correction to ensure optimized optical performance and minimize defects, high-performance camera (Zoom / OIS), ultra-wide-angle camera, and multi-camera alignment technology
- Various packaging process technologies: COB (Chip on Board), CSP (Chip Scale Package), and Flip-chip, responding to a wide range of packaging processes and establishing a mass production system
- DX-based process automation: Implementation of smart factory through DX (Digital Transformation)-based automation system in all areas including production process and quality management

We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

- High-precision Active Alignment: Based on image information, by precisely adjusting the lens position for optical center & tilt correction to ensure optimized optical performance and minimize defects, high-performance camera (Zoom / OIS), ultra-wide-angle camera, and multi-camera alignment technology
- Various packaging process technologies: COB (Chip on Board), CSP (Chip Scale Package), and Flip-chip, responding to a wide range of packaging processes and establishing a mass production system
- DX-based process automation: Implementation of smart factory through DX (Digital Transformation)-based automation system in all areas including production process and quality management

02

3D Sensing Module

  • We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
    We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

    - High-precision Active Alignment
    : Find the optimal position of the LASER light emitting part (Tx) / light receiving part (Rx) optical system, and alignment is carried out to precisely adjust tilt and shift to the world's highest level
    - Calibration/Validation to improve accuracy and repeatability
    : For optimizing the 3D performance of the module, it is a sophisticated and fast algorithm that can tune the characteristics of each key part.(Calibration in progress)
    - Verification of the performance of the completed module in various environments through the evaluation system

02

3D Sensing Module

We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.
We internalize automation-based high-precision facilities in our global production bases and continue to innovate in fixed technologies to maintain uniform performance and quality even in large-scale production.

- High-precision Active Alignment
: Find the optimal position of the LASER light emitting part (Tx) / light receiving part (Rx) optical system, and alignment is carried out to precisely adjust tilt and shift to the world's highest level
- Calibration/Validation to improve accuracy and repeatability
: For optimizing the 3D performance of the module, it is a sophisticated and fast algorithm that can tune the characteristics of each key part.(Calibration in progress)
- Verification of the performance of the completed module in various environments through the evaluation system

03

Actuator

  • The world's first mass-produced continuous zoom camera by LG Innotek Equipped with a high-performance actuator, it performs fast AF and zoom functions without changing the image quality even when the magnification is changed.
    The world's first mass-produced continuous zoom camera by LG Innotek Equipped with a high-performance actuator, it performs fast AF and zoom functions without changing the image quality even when the magnification is changed.

    - High reliability Long Stroke Actuator design
    - Actuator design that moves the lens quickly and accurately with the focus and magnification desired by the actual user
    - Design to minimize the tilt that may occur as the actuator movement distance increases

  • We have the actuator design capability to quickly and stably drive the lens/sensor, the core component of high-performance cameras.
    We have the actuator design capability to quickly and stably drive the lens/sensor, the core component of high-performance cameras.

    - High performance / ultra-precision actuator design
    : Securing actuating reliability by analyzing the stiffness and impact amount of core parts, optimizing driving performance through electromagnetic structure simulation
    - Driver IC design and F/W algorithm internalization
    : Optimization of control performance such as operation speed and OIS of module by developing driver IC and F/W reflecting the characteristics of the company's actuator

03

Actuator

The world's first mass-produced continuous zoom camera by LG Innotek Equipped with a high-performance actuator, it performs fast AF and zoom functions without changing the image quality even when the magnification is changed.
The world's first mass-produced continuous zoom camera by LG Innotek Equipped with a high-performance actuator, it performs fast AF and zoom functions without changing the image quality even when the magnification is changed.

- High reliability Long Stroke Actuator design
- Actuator design that moves the lens quickly and accurately with the focus and magnification desired by the actual user
- Design to minimize the tilt that may occur as the actuator movement distance increases

We have the actuator design capability to quickly and stably drive the lens/sensor, the core component of high-performance cameras.
We have the actuator design capability to quickly and stably drive the lens/sensor, the core component of high-performance cameras.

- High performance / ultra-precision actuator design
: Securing actuating reliability by analyzing the stiffness and impact amount of core parts, optimizing driving performance through electromagnetic structure simulation
- Driver IC design and F/W algorithm internalization
: Optimization of control performance such as operation speed and OIS of module by developing driver IC and F/W reflecting the characteristics of the company's actuator