Semiconductors are at the heart of digital technology. They power every electronic device that make our lives convenient, ranging from small mobile devices such as smartphones and tablets to household appliances such as refrigerators and washing machines, and even electric vehicles and airplanes.
Semiconductors are also closely related to the rise of recent technologies in Cloud, Big Data, Internet of Things (IoT), Autonomous Driving, Augmented Reality, Virtual Reality, the Metaverse, and Robotics. The areas of Artificial Intelligence, servers, data centers, and electric vehicles in particular require high-performance semiconductors, but the performance improvement of semiconductors through micro-processes has reached its limit. Now, industries are paying attention to sophisticated 'Packaging' processes, which are technologies for semiconductor back-end process.
A package substrate electrically connects and mechanically supports the semiconductor. It is the very back bone of semiconductors. The more sophisticated digital devices and semiconductors become, the more crucial package substrates become. FC-BGA (Flip Chip-Ball Grid Array) is a high-density package substrate that connects high-density semiconductor chips such as server CPU (Central Processing Units) and GPU (Graphics Processing Units), touted as the industry’s future growth engine.
